Photovoltaic & semiconductor
Controlled cutting for silicon and process-development materials.
Typical workpieces
Silicon workpieces, process samples and development parts
Applications
Material-led cutting applications
Equipment selection starts with material, workpiece geometry, dimensions and the required cut path.
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Sapphire & silicon carbide
Stable wire travel for hard, brittle advanced materials.
Typical workpieces
Sapphire, silicon carbide and brittle crystal workpieces
Precision ceramics & quartz glass
Configuration-led cutting for brittle technical materials.
Typical workpieces
Ceramic parts, quartz glass and precision components
Graphite & composites
Machine format selected around geometry and cut path.
Typical workpieces
Graphite blocks, composite parts and carbon-based materials
Magnetic materials
Workpiece-led equipment selection and process review.
Typical workpieces
Magnetic material blocks and precision development parts
New materials
RFQ-based evaluation for emerging material systems.
Typical workpieces
New hard-brittle materials and non-standard workpieces