BL-LM200
Gantry‑type Diamond Wire Cutting Machine （BL-LM200）
Diamond wire cutting equipment configured around your material, workpiece and target cut.
Built around the workpiece
The gantry‑type diamond wire cutting machine adopts an integrated gantry frame structure, featuring high rigidity, stable operation and a wide range of processable cutting sizes. It effectively solves common industry pain points of conventional cutting equipment, such as insufficient travel, machine‑body vibration and poor cutting accuracy for large‑size workpieces. Suitable for precision cutting of brittle‑hard materials, composite materials and new‑type materials, this machine is widely used in high‑end industries including carbon fiber, semiconductors, photovoltaic solar energy, sapphire, silicon carbide crystals, optoelectronics and more. Equipped with high‑precision linear guides and precision ball screws for X and Y axes, the machine delivers smooth and uniform feed motion to guarantee overall processing accuracy and operational stability. Fitted with an automatic wire‑tensioning mechanism to realize automatic loop‑wire tensioning, it provides stable cutting conditions for high‑precision workpiece processing. Meanwhile, it maintains constant diamond‑wire tension, greatly reduces wire breakage rate and ensures stable production performance.
- Series
- BL-LM
- Category
- Gantry‑type Diamond Wire Cutting Machine
- Minimum order
- 1 machine
- Model
- BL-LM200
- Automatic constant-tension control
- Touchscreen control panel
- Workpiece-led configuration
- OEM/ODM configuration available