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Bailiang diamond wire cutting machines arranged in the production workshop

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Diamond wire cutting machines for different workpiece geometries

Compare eight equipment models. Final work envelope, wire specification and process parameters are confirmed during RFQ.

Gantry‑type Diamond Wire Cutting Machine （BL-LM100）BL-LM100

Gantry‑type Diamond Wire Cutting Machine （BL-LM100）

The gantry‑type diamond wire cutting machine adopts an integrated gantry frame structure, featuring high rigidity, stable operation and a wide range of processable cutting sizes. It effectively solves common industry pain points of conventional cutting equipment, such as insufficient travel, machine‑body vibration and poor cutting accuracy for large‑size workpieces. Suitable for precision cutting of brittle‑hard materials, composite materials and new‑type materials, this machine is widely used in high‑end industries including carbon fiber, semiconductors, photovoltaic solar energy, sapphire, silicon carbide crystals, optoelectronics and more. Equipped with high‑precision linear guides and precision ball screws for X and Y axes, the machine delivers smooth and uniform feed motion to guarantee overall processing accuracy and operational stability. Fitted with an automatic wire‑tensioning mechanism to realize automatic loop‑wire tensioning, it provides stable cutting conditions for high‑precision workpiece processing. Meanwhile, it maintains constant diamond‑wire tension, greatly reduces wire breakage rate and ensures stable production performance.

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Gantry‑type Diamond Wire Cutting Machine （BL-LM200）BL-LM200

Gantry‑type Diamond Wire Cutting Machine （BL-LM200）

The gantry‑type diamond wire cutting machine adopts an integrated gantry frame structure, featuring high rigidity, stable operation and a wide range of processable cutting sizes. It effectively solves common industry pain points of conventional cutting equipment, such as insufficient travel, machine‑body vibration and poor cutting accuracy for large‑size workpieces. Suitable for precision cutting of brittle‑hard materials, composite materials and new‑type materials, this machine is widely used in high‑end industries including carbon fiber, semiconductors, photovoltaic solar energy, sapphire, silicon carbide crystals, optoelectronics and more. Equipped with high‑precision linear guides and precision ball screws for X and Y axes, the machine delivers smooth and uniform feed motion to guarantee overall processing accuracy and operational stability. Fitted with an automatic wire‑tensioning mechanism to realize automatic loop‑wire tensioning, it provides stable cutting conditions for high‑precision workpiece processing. Meanwhile, it maintains constant diamond‑wire tension, greatly reduces wire breakage rate and ensures stable production performance.

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Gantry‑type Diamond Wire Cutting Machine （BL-LM300）BL-LM300

Gantry‑type Diamond Wire Cutting Machine （BL-LM300）

The gantry‑type diamond wire cutting machine adopts an integrated gantry frame structure, featuring high rigidity, stable operation and a wide range of processable cutting sizes. It effectively solves common industry pain points of conventional cutting equipment, such as insufficient travel, machine‑body vibration and poor cutting accuracy for large‑size workpieces. Suitable for precision cutting of brittle‑hard materials, composite materials and new‑type materials, this machine is widely used in high‑end industries including carbon fiber, semiconductors, photovoltaic solar energy, sapphire, silicon carbide crystals, optoelectronics and more. Equipped with high‑precision linear guides and precision ball screws for X and Y axes, the machine delivers smooth and uniform feed motion to guarantee overall processing accuracy and operational stability. Fitted with an automatic wire‑tensioning mechanism to realize automatic loop‑wire tensioning, it provides stable cutting conditions for high‑precision workpiece processing. Meanwhile, it maintains constant diamond‑wire tension, greatly reduces wire breakage rate and ensures stable production performance.

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Gantry‑type Diamond Wire Cutting Machine （BL-LM400）BL-LM400

Gantry‑type Diamond Wire Cutting Machine （BL-LM400）

The gantry‑type diamond wire cutting machine adopts an integrated gantry frame structure, featuring high rigidity, stable operation and a wide range of processable cutting sizes. It effectively solves common industry pain points of conventional cutting equipment, such as insufficient travel, machine‑body vibration and poor cutting accuracy for large‑size workpieces. Suitable for precision cutting of brittle‑hard materials, composite materials and new‑type materials, this machine is widely used in high‑end industries including carbon fiber, semiconductors, photovoltaic solar energy, sapphire, silicon carbide crystals, optoelectronics and more. Equipped with high‑precision linear guides and precision ball screws for X and Y axes, the machine delivers smooth and uniform feed motion to guarantee overall processing accuracy and operational stability. Fitted with an automatic wire‑tensioning mechanism to realize automatic loop‑wire tensioning, it provides stable cutting conditions for high‑precision workpiece processing. Meanwhile, it maintains constant diamond‑wire tension, greatly reduces wire breakage rate and ensures stable production performance.

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Gantry‑type Diamond Wire Cutting Machine （BL-LM600）BL-LM600

Gantry‑type Diamond Wire Cutting Machine （BL-LM600）

The gantry‑type diamond wire cutting machine adopts an integrated gantry frame structure, featuring high rigidity, stable operation and a wide range of processable cutting sizes. It effectively solves common industry pain points of conventional cutting equipment, such as insufficient travel, machine‑body vibration and poor cutting accuracy for large‑size workpieces. Suitable for precision cutting of brittle‑hard materials, composite materials and new‑type materials, this machine is widely used in high‑end industries including carbon fiber, semiconductors, photovoltaic solar energy, sapphire, silicon carbide crystals, optoelectronics and more. Equipped with high‑precision linear guides and precision ball screws for X and Y axes, the machine delivers smooth and uniform feed motion to guarantee overall processing accuracy and operational stability. Fitted with an automatic wire‑tensioning mechanism to realize automatic loop‑wire tensioning, it provides stable cutting conditions for high‑precision workpiece processing. Meanwhile, it maintains constant diamond‑wire tension, greatly reduces wire breakage rate and ensures stable production performance.

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Flat‑cut Diamond Wire Cutting Machine （BL-PQ600）BL-PQ600

Flat‑cut Diamond Wire Cutting Machine （BL-PQ600）

The flat‑cut diamond wire cutting machine adopts a horizontal cutting‑structure design. Featuring compact overall structure and balanced stress distribution, it performs flat slicing and regular cutting for various hard and brittle plates and blanks based on the horizontal‑feed cutting principle. Supported by mature micro‑cutting technology, the machine delivers narrow cutting kerf and low material loss. Processed workpieces obtain smooth and clean cut surfaces without secondary grinding or polishing. It can meet high‑precision requirements for research samples as well as stable industrial mass‑production demands. Meanwhile, it supports preset and custom adjustment of multi‑specification process parameters to accommodate differentiated cutting requirements for diverse materials.

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Vertical‑cut Contour Diamond Wire Cutting Machine （BL-LQYX300）BL-LQYX300

Vertical‑cut Contour Diamond Wire Cutting Machine （BL-LQYX300）

The vertical‑cut contour diamond wire cutting machine adopts a vertical cutting structure and supports CAD graphic parsing to realize special‑shape cutting of complex contours such as circular arcs and inclined surfaces. Equipped with high‑precision linear guides and ball screws, the machine features sensitive feed response. Combined with a dynamic constant‑tension wire‑tensioning mechanism, it stabilizes diamond wire tension in real time, effectively lowering wire‑breakage risk and suppressing workpiece edge chipping, so as to guarantee dimensional accuracy for complex‑contour machining. With sound structural rigidity and low operating vibration, it can process various hard‑to‑cut brittle substrates including silicon carbide, graphite, special ceramics and composite materials. It is capable of small‑batch R&D sample preparation as well as forming processing for industrial non‑standard parts. It delivers narrow kerf, low material loss and favorable cut‑surface quality to reduce subsequent grinding procedures. Cutting speed and wire‑running parameters can be flexibly adjusted for different materials, meeting customized processing demands for special‑shaped parts in new‑material, semiconductor and carbon‑product industries.

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Hand‑push Diamond Wire Saw （BL-STJ300）BL-STJ300

Hand‑push Diamond Wire Saw （BL-STJ300）

The hand‑push diamond wire saw is an electrically‑driven cutting tool. The motor drives the diamond wire to perform reciprocating motion, while workpieces are fed at a uniform speed by manual pushing to complete cutting operations. Simple to operate, it needs no complex programming and can carry off cutting‑off, edge trimming and simple shaping processing immediately after startup. Compact and lightweight, the machine features narrow cutting kerf and low material loss with smooth cut surfaces, which helps reduce edge chipping and cracking of workpieces. Equipped with a built‑in tension adjustment mechanism, it ensures stable running of the diamond wire and lowers the probability of wire breakage. Compared with large CNC diamond wire cutting machines, this equipment is easy for commissioning, low in maintenance cost and cost‑effective. It fits scenarios including laboratory sample preparation, small‑batch blanking and on‑site processing.

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